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High Density Interconnect Printed Circuit Board Assembly For Electronic

TONGZHAN INDUSTRIAL LIMITED
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High Density Interconnect Printed Circuit Board Assembly For Electronic

Brand Name : CUSTOM MADE

Certification : ISO/UL

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 Weeks

Packaging Details : PCB+ Box

Product Type : Printed Circuit Board Assembly

Surface Treatment : Immersion Gold+OSP

Application : Consumer Electronics , Electronics Device

Materials : Rogers , Nelco

Special Power : Peelable

Max Board Size : 650mm*1130mm

Min Width/Space : 2.4 / 2.4mil

Min Outline Tolerance : ±0.1mm

Payment Method : T/T

Whether to Support customization : Support

Logistics : Accept customer specified logistics

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High Density Interconnect Printed Circuit Board Assembly For Electronic

High-Density Interconnect PCB Assembly For Advanced Electronics Printed Circuit Board Assembly

Printed Circuit Board Assembly Description:

Our high-density interconnect (HDI) printed circuit board assembly (PCBA) is designed for advanced electronics requiring superior performance and miniaturization. The HDI technology enables higher component density, better signal integrity, and improved electrical performance compared to traditional PCBAs.

Utilizing cutting-edge laser drilling and micro-via technology, our experienced engineers can create a customized HDI PCBA that meets your specific design requirements. Our HDI PCBAs are perfect for applications such as smartphones, medical devices, and aerospace systems, where space and weight constraints are critical.

We maintain strict quality control measures, including AOI, X-ray inspection, and functional testing, to ensure each HDI PCBA meets or exceeds industry standards. Elevate your electronic device's performance with our advanced HDI PCB assembly.

Printed Circuit Board Assembly Parameters:

Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP

Printed Circuit Board Assembly Introduction:

Tongzhan was established in 2011 and is committed to becoming a leading one-stop EMS provider. We are good at project management and cost reduction of EMS. Tongzhan specializes in electronic manufacturing services for its customers. Our services include PCB design, PCB fabrication, parts sourcing, PCB assembly, and testing. We manufacture using materials commissioned by our customers, as well as our full turnkey project of sourcing, inspecting, and supporting raw materials. We embrace a fast-paced and dynamic work environment. We focus on innovation and delivering great products. Our agility allows us to define and redefine our markets.

High Density Interconnect Printed Circuit Board Assembly For Electronic


Product Tags:

High Density Printed Circuit Board Assembly

      

Interconnect Printed Circuit Board Assembly

      

TU862 Electronic PCB Assembly

      
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High Density Interconnect Printed Circuit Board Assembly For Electronic Images

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